NV300

2U Half Nvidia Orin Military Computer

 

  • Ultra Short Depth 2U Half Rugged Computer
  • NVIDIA Jetson AGX Orin 32G/64G LPDDR5 DRAM
  • 2x LAN+1x CAN+1x RS232+1x RS422+5x GPIO
  • 1x 10G SFP+
  • 8x GMSL2 (Options)
  • 8x 3G-HDI (Options)
  • IP65 Classified
  • MIL-STD-461 EMI Filter DC 12V~32V(Options)
  • Size : 250x325x84mm (W x D x H)
Categories: ,

Technical Profile

Block Diagram

DIAGRAM

Specifications

System

High performance ProcessorAmpere GPU + Arm Cortex-A78AE CPU + 64GB LPDDR5 + 64GB eMMC 5.1

Ampere GPU + Arm Cortex-A78AE CPU + 32GB LPDDR5 + 64GB eMMC 5.1

GPU64GB: Two graphics processing cluster (GPC) | eight texture processing clusters (TPC) | 2048 NVIDIA® CUDA® cores | 64 Tensor cores Ray-Tracing cores | 170 Sparse TOPS | Maximum Operating Frequency: 1.3 GHz

32GB: Two graphics processing cluster (GPC) | seven texture processing clusters (TPC) | 1792 NVIDIA® CUDA® cores | 56 Tensor cores Ray-Tracing cores | 108 Sparse TOPS | Maximum Operating Frequency: 939 MHz

AI Performance64GB: Up to 275 Sparse TOPS (INT8)

32GB: Up to 200 Sparse TOPs (INT8)

Memory TypeJetson AGX Orin 64GB: 64GB 128-bit LPDDR5 DRAM

Jetson AGX Orin 32GB: 32GB 128-bit LPDDR5 DRAM

 

Expansion Slot

Expansion Slot1x M.2 Key-B, 1x SIM, 1x MicroSD, 1x 5V Fan

1x I2C, 2x UART, 1x I2S, 2x SPI, 1x CAN

1x Camera Connector (6 CSI camera support)

 

Display

Graphics Interfaces1x HDMI 2.0 (max resolution 3840×2160)
 

Storage

M.264 GB eMMC 5.1 Flash

2x M.2 Key-M SSD Slot

Ethernet
Controller2x GLAN
1x 10G (SFP+Based)
 

Front I/O

DC-INDC12-32 VDC
X12x LAN+1x CAN+1x RS232+1x RS422+4x GPIO
X21x10G MPO
X31x HDMI
X41x USB3.0
Button1x Water Resistive Power Button with dual-color LED Backlight
 

Rear I/O (Options)

Antenna2x Antenna holes for Wi-Fi 5/6 modules (PR-SMA ant.)

2x Antenna holes for LTE/5G module (SMA ant.)

1x Antenna hole for GNSS (RP-SMA ant.)

GMSL28x FAKRA SMB Plug Z-code, GMSL2 cameras
3D-HDI8x 3G-HDI
Rear I/O
Ground Screw1
 

Power Requirement

Power InputDC-12-32VDC
 

Operating System

Operating SystemUbuntu 20.04 with JetPack5.1
 

Physical

Dimension250x325x84mm (W x D x H)
WeightTBD
ChassisAluminum AL6061
HeatsinkAluminum Alloy, Corrosion Resistant.
FinishAnodic aluminum oxide (Color).
CoolingNatural Passive Convection/Conduction. No Moving Parts
Ingress ProtectionIP65
 

Environmental

MIL-STD-461 (Options)
EMCCE102 basic curve, 10kHz – 30 MHz

RE102-4, (1.5 MHz) -30 MHz – 5 GHz

RS103, 1.5 MHz – 5 GHz, 50 V/m equal for all frequencies

ReliabilityNo Moving Parts; Passive Cooling.

Designed & Manufactured using ISO 9001/2000 Certified Quality Program.

Operating Temp.-20 to 50°C (ambient with air flow)
Storage Temp.-40 to 85°C
Relative Humidity5% to 95%, non-condensing.

Order Information

Order Information

Download

Attachment
Datasheet