Technical Profile
Introduction
AV200, EBX rugged system is a powerful system that is driven by Intel® 7th generation Kabylake CPU and chipset soldering onboard, integrated with Nvidia GPU GTX 1660S/1050Ti that supports 2 independent DisplayPort. Processor i7-7820EQ plus Intel® QM175 chipset supports clock speed 3.0GHz, up to 3.7GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, AV200 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.
Thermal solution for fanless system design
7starlake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. 7starlake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, AV200 innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C to 60°C.
Support OpenVINO™
The AV200 is an AI hardware ready system ideal for deep learning inference computing, AV200 support Intel OpenVINO™(Open Visual Inference & Neural Network Optimization),Intel® architecture-based processor (CPU) and Integrated GPU and deep learning accelerator (FPGA, Movidius ™ VPU) deep learning acceleration chip to enhance vision system functions and performance. It’s also runs great with the Intel Neural Compute Stick , and helps developers to create cost-effective and robust computer vision applications. It enables deep learning inference at the edge and supports heterogeneous execution across computer vision accelerators.
CPU
The AV200 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
AV200 CPU i7-7820EQ ,NVIDIA GTX1660S Performance
Point | 25°C | 50°C | 55°C | 60°C |
---|
CPU Temperature | 95℃ | 100℃ | 100℃ | 100℃ |
CPU Frequency(Ghz) | 3.39Ghz | 3.08Ghz | 2.84Ghz | 2.65Ghz |
GPU Temperature | 88℃ | 90℃ | 90℃ | 90℃ |
GPU Frequency(Ghz) | 1.68Ghz | 1.44Ghz | 1.2Ghz | 600Mhz |
Test Configuration
Device | Configuration |
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CPU Type | Intel® Core i7-6820EQ 2.8 GHz, Intel® Core i7-7820EQ 3.7 GHz |
PCH | Q170 |
Memory | 1 x DDR4 2400 XR-DIMM up to 16GB w/ECC |
Memory | 1 x DDR4 2400 SO-DIMM up to 16GB w/ECC |
Graphic | NVIDIA GTX1050ti, GTX1660S |
LAN1 | Intel® I219 GbE LAN |
LAN2 | Intel® I210 GbE LAN |
Test Software | Burnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、 iperf GPU-Z、FurMark v1.9.2 |
Chamber | KSON THS-b4t-150 Chipeng SMO-3 |
- Thermal Measurement
- 7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7STARLAKE is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 9 hours which at each temperature point we burn in AV200 for two hour, from 40°C to 60°C.
Device Model | AV200 |
Tester | Robin Chang |
Test Result | Pass |
Test Temperature | High 0°C~60°C / Low -40°C~0°C |
Test Time | 11.5Hours / 3Hours |
Test Standard | Reference IEC60068-2 |
Test Software | Burnin test v6.0 |
Criteria | After testing, system can’t halt. |
Thermal Solution
Effective cooling solution for maximum heat dissipation:
7STARLAKE implements unique cooling solution with heat spreader and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of aluminum, the heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, AV200 can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.