Technical Profile
Introduction
Computer-On-Module (COM) is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module. COM Express Type 6 has become the most versatile and most scalable COM standard supporting everything from small-scaled and cost-sensitive applications up to high-end computing and graphics-intensive solutions.
7StarLake’s SK513-T6 COM Express defines Open Scalable Modular Architecture and pin-out Type 6 platform which is ensuring amazing computing performance and offering a broad range of I/O interfaces including intense graphics support, Digital Display Interfaces (Display Port, HDMI) and super-fast USB 3.0 to serve all kind of different application requirements.
SK513-T6 features a range of Intel processors, including Intel 11th Tiger Lake-H, 9th Coffee Lake-H. From low power consumption to high performance processing power, SK513-T6 is built to suit a wide range of computing applications from signal processing to unmanned vehicles.
Additionally, SK513-T6 is purposely designed to supported wide range temperature from -40°C to 85°C, which is perfectly suitable for withstanding harsh environmental conditions in military, aerospace, and transportation industry.
Rich Expansion Slot
SK513-T6 provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303 , SK1050 and SK1660：
SK506/SK506P:
StackPC-FPE form factor – PCIe/104 stackable bus structure – Reliable Ethernet technology from Intel i350-AM4 controllers – Total 6 independent LAN connections (2 from host board, 4 from Intel controllers) – Flexible options for Ethernets through RJ45 or 10 pin-headers – High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s – Extended temperature -40°C to 85°C
SK401:
- StackPC form factor –
- PCIe/104 stackable bus structure –
- Reserve PCI/104 connector for different stacking criteria –
- Extended temperature -40°C to 85°C
SK303:
- PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
- PCIe/104 stackable bus structure –
- PCIe to PCI adapter function –
- COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function –
- Extended Temp.: -40°C to 85°C
NVIDIA® Quadro® RTX5000 MXM 3.1 Graphics Module:
- Powered by NVIDIA® Quadro® RTX5000
- MXM 3.1Type-B Module
- 256-bit, 16GB GDDR6 Memory
- 3072 CUDA cores, 48 RT cores, and 384 Tensor cores
- 9.4 TFLOPS peak FP32 performance
- Support up to 4 DP 1.4b displays, 110W TGP
NVIDIA® Quadro® RTX3000 MXM 3.1 Graphics Module:
- Powered by NVIDIA® Quadro® RTX3000
- MXM 3.1Type-B Module
- 192-bit, 6GB GDDR6 Memory
- 1920 CUDA cores, 30 RT cores, and 240 Tensor cores
- 5.3 TFLOPS peak FP performance
- Support up to 4 DP 1.4a displays, 80W TGP
NVIDIA® GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU. Designed for Driverless Vehicle
- Intel® 7th Gen. Core i7-7820EQ
- 2 x DDR4 SO-DIMM up to 32GB
- MXM Graphic Card support
- 2 x RJ45 LAN, 6 x USB
- 2 x 2.5″ Easy swap SSD/HDD Tray
- 2 x I/O Expansion Design
- Extended Temperature -20°C to 60°C
- NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU
1.5 U Fanless Rugged GPU Server Intel® Xeon® D Processor, MXM Graphic Card, 9~36V DC-IN, Operating Temp -20°C to 50°C.
NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU
- MIL-STD 810G Compliance
- Intel® Xeon® D-1548 Processor
- 2 x DDR4 SO-DIMM up to 32GB RAM
- MXM Graphic Card support
- 4 x Intel® Gigabit Ethernet
- 2 x CAN bus
- 4 x USB, 1 x COM
- 9~36V DC-IN
- Operating Temp. -20°C to 50°C
- NVIDIA® GTX 1050 Ti(CUDA 768 GDDR5-4GB) / GTX1650 (CUDA 896 GDDR5-4GB) / GTX1660 Super (CUDA 1408 GDDR6-6GB)
