PS2

Dual Display Portable GPU Server

 

  • Dual 23.8″ FULL HD 1920X1080  Portable GPU Server
  • Optional for UFD 3840X2160
  • MIL-STD810 Thermal, shock, vibration, Humidity / EMI / EMC Resistance
  • Intel® Ice Lake 3rd Gen. Xeon® Scalable CPU
  • Nvidia Quadro RTXA4000 GPU (6,144 CUDA)
  • Redundant AC 100~240V Input
  • MIL-STD -461 18V~36V DC-Input (optional)
  • Extreme Temperature : -20°C to +55°C

Applications

 

  • Naval Tracking Radar Displays
  • Naval Optronic Displays
  • Marine ECDIS Consoles
  • Naval WECDIS Consoles
  • Air Defence Tracking Radar Displays
  • Air Defence Optronic Displays

Intel Gold

Categories: , , ,

Technical Profile

Multifunction Naval Console

PS2 – Dual 23.8” UFD TFT-LCD Multifunction Naval Console provides a sophisticated, graphically-orientated, Human-Machine Interface (HMI) for any naval or marine application. The PS2 can simultaneously display HMI graphics and text from multiple software applications as well as display images from several video sensors and overlay high-resolution graphics and symbology over the video images.

 

In addition, the PS2 allows the human user to interact with the application using a combination of QWERTY keyboard, mini touch-entry color TFT-LCD display, handgrip, rollerball, fast function keys, programmable soft-keys and on-screen menus.

PS2

System Features
  • Dual 23.8” TFT-LCD Portable GPU Server
  • MIL-STD810 Thermal, shock, vibration,Humidity / EMI / EMC Resistance
  • Intel® Ice Lake 3rd Gen. Xeon® Scalable CPU
  • Nvidia Quadro RTXA4000 GPU (6,144 CUDA) Redundant AC 100~240V Input
  • MIL-STD -461 18V~36V DC-Input (optional)
  • Extreme Temperature : -20°C to +55°C

 

I/O Interface

  • X1: 1 x VGA , with D38999 connector
  • X2: 2 x Giga LAN , with D38999 connector
  • X3: 2 x COM , with D38999 connector
  • X4: 2 x USB2.0 , with D38999 connector
  • X5: 1 x USB3.0 , with D38999 connector
  • X6: 1 x DC-in , with D38999 connector
PS2

PS2

Specifications

System

 

DISPLAYDUAL 23.8″ TFT-LCD , LCM, FULL HD 1920X1080 – 250 NITS (Optional for 1000Nits)
CPUIntel® Xeon® Scalable Processors

Single Socket LGA-4189 supported,

CPU TDP supports Up to 165W TD

Memory type6 DIMM slots

Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC RDIMM,

DIMM SizesLRDIMM: 32GB, 64GB, 128GB

RDIMM: 8GB, 16GB, 32GB, 64GB

ChipsetIntel® C621
GraphicsASPEED AST2500 BMC
GPU (optional)Nvidia RTXA4000, NVIDIA Ampere GPU architecture

6,144 NVIDIA® CUDA® Cores, 192 NVIDIA® Tensor Cores

16GB GDDR6 Memory with ECC, Up to 448 GB/s Memory Bandwidth

Max. Power Consumption: 140 W

Expansion Slot (PCI-E)2x PCI-E 3.0 x16, 1x PCI-E 3.0 x8
Expansion Slot (M.2)M.2 Interface: PCI-E 3.0 x4

Form Factor: 2280, 2242

Key: M-Key

BIOSAMI UEFI

ACPI 6.0

RTC (Real Time Clock) Wakeup

 

Storage

SATA2x SATA3 SSD (6Gbps) port (s)  (Max 12 SATA3)
 

Ethernet

Ethernet (Internal)Dual LAN

with 1GbE with Intel® X722 + Marvell 88E1512

 

Front I/O

X11x VGA , with D38999 connector
X22x Giga LAN , with D38999 connector
X32x COM , with D38999 connector
X42x USB2.0 , with D38999 connector
X51x USB3.0 , with D38999 connector
X61x DC-in , with D38999 connector
 

Power

Power inputRedundant AC 100~240V Input

MIL-STD -461 18V~36V DC-Input for optional

 

Operating System

OSWindows® 10 64-bit / Linux (support by request)
 

Physical

DimensionHEIGHT: 16.31″ (414MM)

WIDTH: 24.58″ (624MM)

DEPTH: 10.56″ (268MM)

WeightActive Cooled 15 Kg

Conduction Cooled 20 Kg

ChassisSECC
HeatsinkHeatsink Aluminum Alloy with Fan
 

Environmental

Green ProductRoHS, WEEE compliance
Operating Temp.-20 to 60°C
Storage Temp.-40 to 85°C
Relative Humidity5% to 95%, non-condensing
 

MIL-STD-810 Specifications (Operating)

Method 502.5Low Temperature-20°C, 4 hours, ±3°C
Procedure 2
Method 501.5High Temperature+60°C, 4 hours, ±3°C
Procedure 2
Method 507.5Humidity85%-95% RH without condensation,

24 hours/ cycle, conduct 10 cycles.

Method 514.6Vibration5-500Hz, Vertical 2.20Grms, 40mins x 3axis.
Method 516.6Shock20 Grms, 11ms, 3 axes.
 

MIL-STD-810 Specifications (Non-Operating)

Method 502.5Low Temperature Storage-33°C, 4 hours, change rate:≦20°C/ Hour

-15°C, 72hours (By request)

Procedure 1
Method 501.5High Temperature Storage+71°C, 4 hours, change rate:≦20°C/ Hour

+63°C, 240 hours (By request)

Procedure 1
Method 514.6Vibration5-500Hz, Vertical 2.20Grms, 40mins x 3axis.
Method 516.6Shock20 Grms, 11ms, 3 axes.

Download

Attachment
Datasheet
Manual