ROC286B

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Technical Profile

Introduction

 

ROC286B is an industrial 19” 1U Rack-mount rugged fanless server. Based on Intel® Coffeelake 14nm Core™ Q370 Chipset, ROC286B can be processed by 8th/9th  Processor(up to 65W). It supports up to 64GB of memory capacity, 1 x PCIe x16 Slot 1 x M.2(Key M, PCIe x4 and SATA3) Expansion Slot,4 x USB3.1, 3 x DisplayPort, 2 x LAN, 1 x Line-out/Mic,2 x 2.5” SATA HDD/ SSD Easy Swap Tray.

With further advantages, for example, HDD/ SSD easy swap tray and multi-expansion slot, we believe that ROC286B  is a best choice for those, who are looking for an ideal server to meet the requirements of commercial and industrial platforms, process control, intelligent automation and manufacturing applications.

286B

286B

Specification

System

High Performance ProcessorSocket LGA 1151 for Intel® Core i7/i5/i3/Celeron® (Supports up to 65W) Intel® 8th/9th Processor
Memory type2x DDR4 2400/2666 MHz SO-DIMM up to 64GB
ChipsetIntel® Q370 Chipset
Expansion Slot1x PCIex16

1x M.2 (Key M, 2242/2280) with PCIe and SATA Signal

 

Storage

HDD/SDD2x 2.5” SATA HDD/SSD easy swap tray
 

Ethernet

EthernetIntel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)

Rear I/O

Display Port2x
HDMI1x
Ethernet2x RJ45 Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps)
Audio2x 3.5mm Audio Jacks (1x MIC, 1x Line-Out)
COM2x RS232/422/485 (422 / 485 select by BIOS)
USB Port4x USB 3.1(10Gb/s)
AC-IN1x AC-IN, 90V~260V
 

Front I/O

Button1x Power Button w/Indicator LED
Indicator LED1x HDD
USB Port2x USB 2.0
Easy Swap SSD Tray2x
 

Applications, Operating System

ApplicationsCommercial and Industrial Platforms, Embedded Computing, Process Control,

Intelligent Automation and manufacturing applications

Operating SystemWindows 10 64Bit

Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20

Physical

Dimension (W x D x H)430 x450 x 44 mm
Weight8.5Kg
ChassisSECC
HeatsinkAluminum Alloy, Corrosion Resistant
FinishAnodic aluminum oxide

Environmental

MIL-STD-810 TestMethod 507.5, Procedure II (Temperature & Humidity)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Green ProductRoHS compliance
Operating Temperaturew/o Graphic Card (ET: -20 to 60°C; UT: -30 to 70°C) ; w/Graphic Card (0 to 50°C)
Storage Temperature-40 to 85°C
Relative Humidity5% to 95%, non-condensing
EMCCE and FCC compliance

Thermal Solution

Dual Side Thermal Solution, Fanless Design for 1U Slim Size

 

With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.

Download

Attachment
Datasheet
Manual